Diamond Polishing Emulsion for Knife Stropping

• Customization: Available
• Type: Industrial Cleaning Cloth
• Abrasive: Corundum
• Nylon Wheel Type: Clean & Strip Wheel
• Materials Abraded: Nonferrous Metal
• Grade: Ultra-Fine
• Wing Wheel Shape: Interleaved
• Fastening Type: Arbor Hole
• Color: White
• Industrial Cleaning Cloth Type: Sanding Sponge
• Transport Package: Carton
• Specification: 250 300 350
• Trademark: SIGNI
• Origin: China
• HS Code: 3405900000
• Production Capacity: 5000000gal/Year

Product Description

SIGNI Poly Diamond Emulsions have been specifically formulated to surpass all other stropping sprays emulsions and compounds on the market. The Poly crystalline diamonds work incredibly fast to create and leave a smooth, polished and sharp surface, and are superior to mono diamond products in almost all settings. Our emulsion formula keeps the poly diamond particles suspended indefinitely, and makes for a speedy drying period, allowing you to get some work done.

SIGNI Poly Diamond Emulsions are applied to your knife stropping compounds and emulsions. To use, simply pump the desired amount of emulsion on your stropping medium, spread evenly, let dry, then use as usual.

SIGNI Poly Diamond Emulsions are available in seven different abrasive grits: 4 micron/4K, 2 micron/8K, 1 micron/16K, 0.5 micron/30K, 0.25 micron/60K, 0.10 micron/160K, and 0.025 micron/600K.

SIGNI Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity deionized water, highly
   engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove



 excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical
polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a 
wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on 
the pH.

SIGNI CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. Signi supplies CMP polishing slurry to customers around the world and is the most competitive in quality
 and price. 

Features
High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
High purity: the content of Cu2+<50 ppb, without contamination on the work piece 
Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface

Typical Properties
Alkaline Type pH: 9.8±0.5	SOQ-2	SOQ-4	SOQ-6	SOQ-8	SOQ-10	SOQ-12
Acidic Type pH: 2.8±0.5	ASOQ-2	ASOQ-4	ASOQ-6	ASOQ-8	ASOQ-10	ASOQ-12
Grit Size(nm)	10~30	30~50	50~70	70~90	90~110	110~130
Appearance	Milk white or semitransparent liquid
Density (g/ml)	1. 15±0.05

 

Component	Content(wt%)
SiO2	15~30
Na2	≤0.3
Heavy metal impurity	≤50 ppb