Chemical Mechanical Polishing CMP Slurry for Sapphire Substrate Screen Wafer Mn-1903

• Customization: Available
• Type: Special Shaped Products
• Materials Abraded: Nonferrous Metal
• Grade: Ultra-Fine
• Wing Wheel Shape: Interleaved
• Fastening Type: Arbor Hole
• Color: White
• Industrial Cleaning Cloth Type: Sanding Sponge
• Transport Package: Carton
• Specification: 250 300 350
• Trademark: SIGNI
• Origin: China
• HS Code: 3405900000
• Production Capacity: 5000000gal/Year

Product Description

CMP Polishing Slurry for Sapphire Polishing 

 

1. Appearance:

White water base suspension

2. Application:

 Polishing semiconductor wafers, precision ceramic, metal and other materials.

 

3. Specification:

 

Size (micron)	0.30,0.20,0.15,0.10
PH	11-13	3.5-4.5
Content %	19-22	29-31
Suspensibility	good	good

4. Characteristics:

(1) High purity alumina particles dispersed in deionized water medium

(2) Higher hardness makes it have good grinding performances than silica polishing slurry, not only can achieve higher grinding effect, but also can get better surface roughness.

5. Package:

500g/bottle; 5kg/barrel

SIGNI Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity deionized water, highly
   engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove



 excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical
polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a 
wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on 
the pH.

SIGNI CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. Signi supplies CMP polishing slurry to customers around the world and is the most competitive in quality
 and price. 

Features
High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
High purity: the content of Cu2+<50 ppb, without contamination on the work piece 
Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface

Typical Properties
Alkaline Type pH: 9.8±0.5	SOQ-2	SOQ-4	SOQ-6	SOQ-8	SOQ-10	SOQ-12
Acidic Type pH: 2.8±0.5	ASOQ-2	ASOQ-4	ASOQ-6	ASOQ-8	ASOQ-10	ASOQ-12
Grit Size(nm)	10~30	30~50	50~70	70~90	90~110	110~130
Appearance	Milk white or semitransparent liquid
Density (g/ml)	1. 15±0.05

 

Component	Content(wt%)
SiO2	15~30
Na2O	≤0.3
Heavy metal impurity	≤50 ppb

 

Silica Wafer Polishing Reference Data
Polishing Pressure	150 ~ 250 g/cm2
Polishing Temperature	32 ~ 40 °C (89 ~ 104 °F)
Dilution	1:1 - 20
Polishing duration	3 ~ 6 minutes

 
Packaging: 
500 ml/bottle, 25 kg or 200 kg/barrel. 
Customizations are available upon requests.
 
Storage: 
Keep the stored temperature at 0~35ºC (32~95 °F). Frozen can result in irreversible product degradation below 0ºC. High temperature above 35 ºC may accelerate the
 growth of micro-organisms and gelation, as well as decrease the long-term stability of the silica sol. Generally, the storage time of alkaline slurries is about two years and of acidic slurries is
 about half a year.